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1

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

2

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim,, Joo Yeon Lee,, Kyung-Wook Paik,, Kwang-Won Koh,, Jinhee Won,, Sihyun Choe,, Jin Lee,, Jung-Tak Moon,, Yong-Jin Park,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 929 KB

english, 2003

3

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jeong-Tak Moon, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 571 KB

english, 2006

4

Osteoporosis affects component positioning in computer navigation-assisted total knee arthroplasty

Dae-Hee Lee, Debabrata Padhy, Soon-Hyuck Lee, Kyung-Wook Nha, Ji-Hun Park, Seung-Beom Han

Journal:

Year:

2012

Language:

english

File:

PDF, 486 KB

english, 2012

5

Effect of Ag Addition on the Ripening Growth of Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Moon Gi Cho, Yong Sung Park, Sun-Kyoung Seo, Kyung-Wook Paik, Hyuck Mo Lee

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.09 MB

english, 2011

6

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface

Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-Wook

Year:

2010

Language:

english

File:

PDF, 2.28 MB

english, 2010

7

Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jae-Won Jang,, Kyoung-Lim Suk,, Jin-Hyoung Park,, Kyung-Wook Paik,, Soon-Bok Lee,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.31 MB

english, 2014

8

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish

Yong-Sung Park,, Yong-Min Kwon,, Ho-Young Son,, Jeong-Tak Moon,, Byung-Wook Jeong,, Kyung-In Kang,, Kyung-Wook Paik,

Year:

2007

Language:

english

File:

PDF, 18.71 MB

english, 2007

9

Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 3.47 MB

english, 2007

10

[IEEE 2014 International Symposium on Consumer Electronics (ICSE) - JeJu Island, South Korea (2014.6.22-2014.6.25)] The 18th IEEE International Symposium on Consumer Electronics (ISCE 2014) - Compact video signatures for near-duplicate detection on mobile devices

Park, Kyung-Wook, Hong, Hyun-Ki, Lee, Dong-Ho

Year:

2014

Language:

english

File:

PDF, 217 KB

english, 2014

11

A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 790 KB

english, 2010

12

2009 Index IEEE Transactions on Components and Packaging Technologies Vol. 32

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 192 KB

english, 2009

13

[ACM Press the 9th International Conference - Bali, Indonesia (2015.01.08-2015.01.10)] Proceedings of the 9th International Conference on Ubiquitous Information Management and Communication - IMCOM '15 - Visual saliency detection via hypergraph based re-ranking using background priors

Park, Kyung-Wook, Lee, Dong-Ho

Year:

2015

Language:

english

File:

PDF, 513 KB

english, 2015

14

-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong, Kim, Tae-Wan, Zhang, Shuye, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 4.31 MB

english, 2016

15

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

Lee, HanMin, Lee, SeYong, Park, JongHo, Chung, Chang-kyu, Jang, Kyung-Woon, Kim, Il, Choi, SeongWoo, Paik, Kyung-Wook

Year:

2018

Language:

english

File:

PDF, 623 KB

english, 2018

16

Low-Temperature Bonding of PZT (PbZrTiO 3 ) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong, Park, Jong Cheol, Shin, SangMyung, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 2.32 MB

2019

17

Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder

Ki-Hwan Kim, Jong-Man Park, Chang-Kyu Kim, Gerard L. Hofman, Kyung-Wook Paik

Journal:

Journal of Nuclear Materials

Year:

1999

Language:

english

File:

PDF, 804 KB

english, 1999

18

Proteome analysis of hairy root from Panax ginseng C. A. Meyer using peptide fingerprinting, internal sequencing and expressed sequence tag data

Seung Il Kim, Jin Young Kim, Eun A. Kim, Kyung-Hoon Kwon, Kyung-Wook Kim, Kun Cho, Jeong Hwa Lee, Myung Hee Nam, Deok-Chun Yang, Jong Shin Yoo, Young Mok Park

Journal:

Year:

2003

Language:

english

File:

PDF, 186 KB

english, 2003

19

ZnGa2O4thin films fabricated by Sol-gel spinning coating process

Kyung-Wook Park, Young-Hoon Yun, Sung-Churl Choi

Journal:

Journal of Electroceramics

Year:

2006

Language:

english

File:

PDF, 300 KB

english, 2006

20

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jin Lee, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.72 MB

english, 2004

21

A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates

Ho-Young Son, Gi-Jo Jung, Byung-Jin Park, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 947 KB

english, 2008

22

Photoluminescence characteristics of ZnGa2O4 thin films prepared by chemical solution method

Kyung-Wook Park, Young-Hoon Yun, Sung-Churl Choi

Journal:

Solid State Ionics

Year:

2006

Language:

english

File:

PDF, 888 KB

english, 2006

23

The effect of reduction ratio of hot rolling on texture and secondary recrystallization of MA 754 plate

Jung-Hoon Lee, Lee-Ju Park, Sang-Beom Kim, Kyung-Wook Paik

Journal:

Journal of Materials Science Letters

Year:

1999

Language:

english

File:

PDF, 270 KB

english, 1999

24

The Effect of High Temperature Deformation Conditions on the Secondary Recrystallization of MA 754 Plate

Jung-Hoon Lee, Kyung-Wook Paik, Lee-Ju Park, Young-Gil Kim, J.H Tundermann, J.J deBarbadillo

Journal:

Scripta Materialia

Year:

1998

Language:

english

File:

PDF, 508 KB

english, 1998

25

Acute toxic encephalopathy due to the ingestion of Rhus extract

Tai-Seung Nam, Seong-Min Choi, Kyung-Wook Kang, Joon-Tae Kim, Seung-Han Lee, Man-Seok Park, Byeong-Chae Kim, Myeong-Kyu Kim, Ki-Hyun Cho

Journal:

Journal of Clinical Neuroscience

Year:

2009

Language:

english

File:

PDF, 229 KB

english, 2009

26

Interleukin-4 Promoter Polymorphism -590 in Nasal Polyp Subjects and the Relation to Arachidonic Acid

Seong-Kook Park, Kyung-Wook Heo, Sung-Su Yea, Young-Il Yang

Journal:

Otolaryngology - Head and Neck Surgery

Year:

2005

Language:

english

File:

PDF, 55 KB

english, 2005

27

R123: Gene Expression Profiles in Ex Vivo Model of Nasal Polyp

Kyung-wook Heo, Seong-kook Park

Journal:

Otolaryngology - Head and Neck Surgery

Year:

2006

Language:

english

File:

PDF, 43 KB

english, 2006

28

R123: PAFR and NOS in Adenoid with Middle Ear Effusion

Tae-hee Han, Seong-kook Park, Kyung-Wook Heo, Sae-gwang Park

Journal:

Otolaryngology - Head and Neck Surgery

Year:

2007

Language:

english

File:

PDF, 40 KB

english, 2007

29

Enhanced Thermal Conductivity of Epoxy-Graphene Composites by Using Non-Oxidized Graphene Flakes with Non-Covalent Functionalization

Song, Sung Ho, Park, Kwang Hyun, Kim, Bo Hyun, Choi, Yong Won, Jun, Gwang Hoon, Lee, Dong Ju, Kong, Byung-Seon, Paik, Kyung-Wook, Jeon, Seokwoo

Journal:

Advanced Materials

Year:

2013

Language:

english

File:

PDF, 1015 KB

english, 2013

30

Predictive Value of Painful Popping for a Posterior Root Tear of the Medial Meniscus in Middle-Aged to Older Asian Patients

Bae, Ji-Hoon, Paik, Nak Hwan, Park, Gyu-Won, Yoon, Jung-Ro, Chae, Dong-Ju, Kwon, Jae Ho, Kim, Jong In, Nha, Kyung-Wook

Journal:

Arthroscopy: The Journal of Arthroscopic & Related Surgery

Year:

2013

Language:

english

File:

PDF, 345 KB

english, 2013

31

Preoperative and Postoperative Comparisons of Navigation and Radiologic Limb Alignment Measurements After High Tibial Osteotomy

Lee, Dae-Hee, Nha, Kyung-Wook, Park, Sung-Joon, Han, Seung-Beom

Journal:

Arthroscopy: The Journal of Arthroscopic & Related Surgery

Year:

2012

Language:

english

File:

PDF, 1015 KB

english, 2012

32

Second-Look Arthroscopic Findings After Open-Wedge High Tibia Osteotomy Focusing on the Posterior Root Tears of the Medial Meniscus

Nha, Kyung-Wook, Lee, Yong Seuk, Hwang, Dae-Hee, Kwon, Jae Ho, Chae, Dong Ju, Park, Young Jee, Kim, Jong In

Journal:

Arthroscopy: The Journal of Arthroscopic & Related Surgery

Year:

2013

Language:

english

File:

PDF, 292 KB

english, 2013

33

[IEEE 2007 IEEE/RSJ International Conference on Intelligent Robots and Systems - San Diego, CA, USA (2007.10.29-2007.11.2)] 2007 IEEE/RSJ International Conference on Intelligent Robots and Systems - An object recognition system for a smart home environment on the basis of color and texture descriptors

Seung-Ho Baeg,, Jae-Han Park,, Jaehan Koh,, Kyung-Wook Park,, Moonhong Baeg,

Year:

2007

Language:

english

File:

PDF, 332 KB

english, 2007

34

[IEEE 2007 International Conference on Control, Automation and Systems - Seoul, South Korea (2007.10.17-2007.10.20)] 2007 International Conference on Control, Automation and Systems - A new object recognition system for service robots in the smart environment

Jae-Han Park,, Seung-Ho Baeg,, Jaehan Koh,, Kyung-Wook Park,, Moon-Hong Baeg,

Year:

2007

Language:

english

File:

PDF, 1.29 MB

english, 2007

35

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu

Cho, Moon Gi, Park, Yong Sung, Seo, Sun-Kyoung, Paik, Kyung-Wook, Lee, Hyuck Mo

Year:

2010

Language:

english

File:

PDF, 1.04 MB

english, 2010

36

[IEEE Third International Conference on Semantics, Knowledge and Grid (SKG 2007) - Xi'an, Shan Xi, China (2007.10.29-2007.10.31)] Third International Conference on Semantics, Knowledge and Grid (SKG 2007) - OLYVIA: Ontology-based Automatic Video Annotation and Summarization System Using Semantic Inference Rules

Park, Kyung-Wook, Lee, Jeong Ho, Moon, Young Shik, Park, Sung Han, Lee, Dong-Ho

Year:

2007

Language:

english

File:

PDF, 786 KB

english, 2007

37

[IEEE RO-MAN 2007 - The 16th IEEE International Symposium on Robot and Human Interactive Communication - Jeju, South Korea (2007.08.26-2007.08.29)] RO-MAN 2007 - The 16th IEEE International Symposium on Robot and Human Interactive Communication - An Object Recognition Scheme Based on Visual Descriptors for a Smart Home Environment

Baeg, Seung-Ho, Park, Jae-Han, Koh, Jaehan, Park, Kyung-Wook, Baeg, Moon-Hong

Year:

2007

Language:

english

File:

PDF, 2.23 MB

english, 2007

38

[IEEE RO-MAN 2007 - The 16th IEEE International Symposium on Robot and Human Interactive Communication - Jeju, South Korea (2007.08.26-2007.08.29)] RO-MAN 2007 - The 16th IEEE International Symposium on Robot and Human Interactive Communication - RoboMaidHome: A Sensor Network-based Smart Home Environment for Service Robots

Baeg, Seung-Ho, Park, Jae-Han, Koh, Jaehan, Park, Kyung-Wook, Baeg, Moon-Hong

Year:

2007

Language:

english

File:

PDF, 2.92 MB

english, 2007

39

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications

Ho-Young Son,, Yong-Woon Yeo,, Gi-Jo Jung,, Jun-Kyu Lee,, Joon-Young Choi,, Chang-Joon Park,, Min-Suk Suh,, Soon-Jin Cho,, Kyung-Wook Paik,

Year:

2005

Language:

english

File:

PDF, 3.41 MB

english, 2005

40

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Improvement of drop shock and TC reliability for large die Wafer Level Packages in mobile application

Lee, Jun-Kyu, Park, Yun-Mook, Kang, In-Soo, Kwon, Yong-Min, Paik, Kyung-Wook

Year:

2009

Language:

english

File:

PDF, 1.92 MB

english, 2009

41

[IEEE 2008 19th International Conference on Pattern Recognition (ICPR) - Tampa, FL, USA (2008.12.8-2008.12.11)] 2008 19th International Conference on Pattern Recognition - π-SIFT: A photometric and Scale Invariant Feature Transform

Park, Jae-Han, Park, Kyung-Wook, Seung-Ho Baeg,, Moon-Hong Baeg,

Year:

2008

Language:

english

File:

PDF, 1.04 MB

english, 2008

42

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moiré

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Year:

2008

Language:

english

File:

PDF, 3.36 MB

english, 2008

43

[IEEE 2008 International Conference on Control, Automation and Systems (ICCAS) - Seoul, South Korea (2008.10.14-2008.10.17)] 2008 International Conference on Control, Automation and Systems - Reliable feature point detection and object pose estimation using photometric quasi-invariant SIFT

Park, Jae-Han, Park, Kyung-Wook, Seung-Ho Baeg,, Moon-Hong Baeg,

Year:

2008

Language:

english

File:

PDF, 1.37 MB

english, 2008

44

[IEEE 2014 International Symposium on Consumer Electronics (ICSE) - JeJu Island, South Korea (2014.6.22-2014.6.25)] The 18th IEEE International Symposium on Consumer Electronics (ISCE 2014) - Process model verifier for integrated medical healthcare systems using business process management system

Kim, Gun-Woo, Park, Kyung-Wook, Hong, Hyun-Ki, Lee, Dong-Ho

Year:

2014

Language:

english

File:

PDF, 381 KB

english, 2014

45

[IEEE 2014 International Conference on Electronics, Information and Communications (ICEIC) - Kota Kinabalu, Sabah, Malaysia (2014.1.15-2014.1.18)] 2014 International Conference on Electronics, Information and Communications (ICEIC) - A user trust model based social multimedia tagging system

Hong, Hyun-Ki, Park, Kyung-Wook, Heu, Jee-Uk, Lee, Dong-Ho

Year:

2014

Language:

english

File:

PDF, 278 KB

english, 2014

46

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Lee, Young-Woo, Lee, Jae-Hong, Paik, Kyung-Wook

Year:

2010

Language:

english

File:

PDF, 2.46 MB

english, 2010

47

[IEEE 2014 International Symposium on Consumer Electronics (ICSE) - JeJu Island, South Korea (2014.6.22-2014.6.25)] The 18th IEEE International Symposium on Consumer Electronics (ISCE 2014) - Tag recommendation system for multimedia retrieval in mobile Environment

Hong, Hyun-Ki, Park, Kyung-Wook, Lee, Dong-Ho

Year:

2014

Language:

english

File:

PDF, 205 KB

english, 2014

48

[IEEE ICT 2005. 24th International Conference on Thermoelectrics, 2005. - Clemson, SC, USA (2005.06.19-2005.06.23)] ICT 2005. 24th International Conference on Thermoelectrics, 2005. - Thermoelectric properties of doped CoSb/sub 3/ prepared by vacuum induction melting

Il-Ho Kim,, Kwan-Ho Park,, Kyung-Wook Jang,, Ur, S.-C., Jung-Il Lee,, Soon-Yong Kweon,, Tae-Whan Hong,

Year:

2005

Language:

english

File:

PDF, 304 KB

english, 2005

49

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis

Son, Ho-Young, Paik, Kyung-Wook, Kim, Ilho, Park, Jin-Hyoung, Lee, Soon-Bok, Jung, Gi-Jo, Park, Byung-Jin, Byun, Kwang-Yoo

Year:

2008

Language:

english

File:

PDF, 9.46 MB

english, 2008

50

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Effects of the Functional Groups of Non-Conductive Films (NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Chang-Kyu Chung,, Woon-Seong Kwon,, Jin-Hyoung Park,, Soon-Bok Lee,, Kyung-Wook Paik,

Year:

2005

Language:

english

File:

PDF, 2.80 MB

english, 2005

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